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Details of leaf spring products

Material Used:
Material Phosphor Bronze C5212
Plate Thickness 0.04㎜
Plating Ag (silver)
Applications: Slide switch contact parts (clip)
Machining Process: Contact (clip) pressure adjusted by adjusting press processing load.
Material Used:
Material Phosphor Bronze C5212
Plate Thickness 0.04㎜
Plating Ag (silver)
Applications: Slide switch contact parts (clip)
Machining Process: Contact (clip) pressure is adjusted by adjusting press processing load.
Materials Used:
Material Phosphor Bronze C5212
Plate Thickness 0.12 mm
Plating Ag (silver)
Applications: Slide switch contact parts (brush)
Machining Process: Narrow slits are bent, then managed at the same height.
Materials Used:
Material Phosphor Bronze C5210
Plate Thickness 0.06㎜
Plating Ag (silver)
Applications: Slide switch contact parts (brush)
Machining Process: Narrow slits are bent, then managed at the same height.
Materials Used:
Material Phosphor Bronze C5210
Plate Thickness 0.06 mm
Plating Au (gold)
Applications: Slide switch contact parts (brush)
Machining Process: Narrow slits are bent, then managed at the same height.
Materials Used:
Material Phosphor Bronze C5212
Plate Thickness 0.06㎜
Plating Ag (silver)
Applications: Push button switch contact parts.
Machining Process: Manages the pressing load of objects bent into arch shapes.
Materials Used:
Material Brass C2680
Plate Thickness 0.10㎜
Plating Sn (tin)
Applications: Width of ≤1 mm bent into U-shape, edge bent into V-shape.
Machining Process: U-shape, V-shape bend dimensions managed in 10s of microns.
Materials Used:
Material Brass C2680
Plate Thickness 0.10㎜
Plating Ag (silver)
Applications: Rotary encoder terminals
Machining Process: The machining process does not twist thin terminals of patterns.